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Map → L2 Silicon, Memory & Packaging → Tongfu Microelectronics

Tongfu Microelectronics

Nantong, CN · founded 1997
L2 · Silicon, Memory & Packaging
foundry & packagingincumbentpublic

Tongfu Microelectronics is a Chinese packaging and test company with strong exposure to processor and advanced package assembly. It is an important local back-end partner for complex compute chips.

Ecosystem functionTongfu helps China and its partners package advanced processors closer to home, and that packaging role is what makes it strategically important in AI hardware.

Business modelPackaging and test services

Revenue—
Valuation$15.54Breported
Last round—
Sources · 3 ↓
  1. http://www.tfme.com/
  2. https://companiesmarketcap.com/tongfu-microelectronics/marketcap/
  3. https://www.amd.com/en/corporate/about-amd/history/amd-and-tongfu.html
Suggest an editLast verified 2026-07-23
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